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1. general description the cbt3251 is a 1-of-8 high-speed ttl-compatible fet multiplexer/demultiplexer. the low on-resistance of the switch allows inputs to be connected to outputs without adding propagation delay or generating additional ground bounce noise. when output enable ( oe) is low, the cbt3251 is enabled. s0, s1, and s2 select one of the b outputs for the a-input data. the cbt3251 is characterized for operation from - 40 c to +85 c. 2. features n 5 w switch connection between two ports n ttl-compatible input levels n minimal propagation delay through the switch n esd protection exceeds 2000 v hbm per jesd22-a114, 200 v mm per jesd22-a115 and 1000 v cdm per jesd22-c101 n latch-up testing is done to jedec standard jesd78 which exceeds 100 ma 3. ordering information [1] also known as qsop16. cbt3251 1-of-8 fet multiplexer/demultiplexer rev. 01 21 december 2005 product data sheet table 1: ordering information t amb = - 40 c to +85 c. type number topside mark package name description version cbt3251d cbt3251d so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1 cbt3251db ct3251 ssop16 plastic shrink small outline package; 16 leads; body width 5.3 mm sot338-1 cbt3251ds cbt3251 ssop16 [1] plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm sot519-1 cbt3251pw cbt3251 tssop16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1
cbt3251_1 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 21 december 2005 2 of 16 philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer 4. functional diagram fig 1. logic diagram of cbt3251 (positive logic) 002aab820 11 7 oe s0 b8 12 b7 13 b6 14 b5 15 b4 1 b3 2 b2 3 b1 4 a 5 10 s1 9 s2 cbt3251
cbt3251_1 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 21 december 2005 3 of 16 philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer 5. pinning information 5.1 pinning 5.2 pin description [1] b outputs are inputs if a inputs are outputs. fig 2. pin con?guration for so16 fig 3. pin con?guration for ssop16 fig 4. pin con?guration for ssop16 (qsop) fig 5. pin con?guration for tssop16 cbt3251d b4 v cc b3 b5 b2 b6 b1 b7 ab8 n.c. s0 oe s1 gnd s2 002aab816 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 b5 b6 b7 b8 s0 s1 s2 b4 b3 b2 b1 a n.c. oe cbt3251db v cc gnd 002aab817 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 b5 b6 b7 b8 s0 s1 s2 b4 b3 b2 b1 a n.c. oe cbt3251ds v cc gnd 002aab818 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 b5 b6 b7 b8 s0 s1 s2 b4 b3 b2 b1 a n.c. oe gnd cbt3251pw v cc 002aab819 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 table 2: pin description symbol pin description b1, b2, b3, b4, b5, b6, b7, b8 1, 2, 3, 4, 12, 13, 14, 15 b outputs [1] a 5 a input n.c. 6 not connected oe 7 output enable (active low) gnd 8 ground (0 v) v cc 16 positive supply voltage
cbt3251_1 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 21 december 2005 4 of 16 philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer 6. functional description refer to figure 1 logic diag r am of cbt3251 (positiv e logic) . 6.1 function selection 7. limiting values [1] the input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. 8. recommended operating conditions [1] all unused control inputs of the device must be held at v cc or gnd to ensure proper device operation. table 3: function selection h = high state; l = low state; x = dont care. inputs function oe s2 s1 s0 llllaport = b1 port lllhaport = b2 port l l h l a port = b3 port l l h h a port = b4 port l h l l a port = b5 port l h l h a port = b6 port l h h l a port = b7 port l hhhaport = b8 port h x x x disconnect table 4: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage - 0.5 [1] +7.0 v v i input voltage - 0.5 [1] +7.0 v i ccc continuous current through each v cc or gnd pin - 128 ma i ik input clamping current v i <0v - - 50 ma t stg storage temperature - 65 +150 c table 5: operating conditions symbol parameter conditions min typ max unit v cc supply voltage 4.5 - 5.5 v v ih high-state input voltage 2.0 - - v v il low-state input voltage - - 0.8 v t amb ambient temperature operating in free air - 40 - +85 c
cbt3251_1 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 21 december 2005 5 of 16 philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer 9. static characteristics [1] all typical values are at v cc =5v, t amb =25 c. [2] this is the increase in supply current for each input that is at the speci?ed ttl voltage level rather than v cc or gnd. [3] measured by the voltage drop between the a and the b terminals at the indicated current through the switch. on-state resista nce is determined by the lowest voltage of the two (a or b) terminals. 10. dynamic characteristics [1] the propagation delay is the calculated rc time constant of the typical on-state resistance of the switch and the speci?ed l oad capacitance, when driven by an ideal voltage source (zero output impedance). [2] output enable time to high and low level. [3] output disable time from high and low level. table 6: static characteristics t amb = - 40 c to +85 c. symbol parameter conditions min typ [1] max unit v ik input clamping voltage v cc = 4.5 v; i i = - 18 ma - - - 1.2 v v pass pass voltage v i =v cc = 5.5 v; i o = - 100 ma 3.4 3.6 3.9 v i li input leakage current v cc = 5.5 v; v i = gnd or 5.5 v - - 1 m a i cc quiescent supply current v cc = 5.5 v; i o = 0 ma; v i = gnd or 5.5 v --3 m a d i cc additional quiescent supply current control inputs; v cc = 5.5 v; one input at 3.4 v; other inputs at v cc or gnd [2] - - 2.5 ma c i input capacitance control pins; v i = 3 v or 0 v - 3.5 - pf c io(off) off-state input/output capacitance a port; v i =3v or 0v; oe = v cc - 17.5 - pf b port; v i =3v or 0v; oe = v cc - 4.0 - pf r on on-state resistance v cc = 4 v; typ. at v cc =4v; v i = 2.4 v; i i =15ma [3] -1420 w v cc = 4.5 v; v i =0v; i i =64ma [3] -57 w v cc = 4.5 v; v i =0v; i i =30ma [3] -57 w v cc = 4.5 v; v i = 2.4 v; i i =15ma [3] -1015 w table 7: dynamic characteristics v cc = +5.0 v 0.5 v; t amb = - 40 c to +85 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit t pd propagation delay from input (a or bn) to output (bn or a) [1] - - 0.25 ns from input (sn) to output (a) 2 - 5.5 ns t en enable time [2] from input (sn) to output (bn) 1.5 - 5.6 ns from input ( oe) to output (a or bn) 1.6 - 5.8 ns t dis disable time [3] from input (sn) to output (bn) 1.9 - 6.4 ns from input ( oe) to output (a or bn) 2.3 - 6.2 ns
cbt3251_1 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 21 december 2005 6 of 16 philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer 10.1 ac waveforms v i = gnd to 3.0 v. t plz and t phz are the same as t dis . t pzl and t pzh are the same as t en . t plh and t phl are the same as t pd . fig 6. input to output propagation delay (1) waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. (2) waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. fig 7. 3-state output enable and disable times 002aab665 3.0 v 0 v v oh v ol t plh t phl 1.5 v 1.5 v input output 1.5 v 1.5 v 002aab823 3 v 3.5 v t plz 1.5 v 1.5 v output control output waveform 1 s1 at 7 v (1) 1.5 v t pzl v ol 0 v v ol + 0.3 v v oh 0 v 1.5 v v ol - 0.3 v output waveform 2 s1 open (2) t pzh t phz
cbt3251_1 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 21 december 2005 7 of 16 philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer 11. test information test data are given in t ab le 8 . all input pulses are supplied by generators having the following characteristics: prr 10 mhz; z o =50 w ; t r 2.5 ns; t f 2.5 ns. the outputs are measured one at a time with one transition per measurement. c l = load capacitance includes jig and probe capacitance. r l = load resistance. fig 8. test circuit table 8: test data test load switch c l r l t pd 50 pf 500 w open t plz , t pzl 50 pf 500 w 7v t phz , t pzh 50 pf 500 w open c l 50 pf 002aab667 r l 500 w from output under test 7 v open gnd s1 r l 500 w
cbt3251_1 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 21 december 2005 8 of 16 philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer 12. package outline fig 9. package outline sot109-1 (so16) x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot109-1 99-12-27 03-02-19 076e07 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1
cbt3251_1 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 21 december 2005 9 of 16 philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer fig 10. package outline sot338-1 (ssop16) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.25 7.9 7.6 1.03 0.63 0.9 0.7 1.00 0.55 8 0 o o 0.13 0.2 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot338-1 99-12-27 03-02-19 (1) w m b p d h e e z e c v m a x a y 1 8 16 9 q a a 1 a 2 l p q detail x l (a ) 3 mo-150 pin 1 index 0 2.5 5 mm scale ssop16: plastic shrink small outline package; 16 leads; body width 5.3 mm sot338-1 a max. 2
cbt3251_1 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 21 december 2005 10 of 16 philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer fig 11. package outline sot519-1 (ssop16) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p z y w v q references outline version european projection issue date iec jedec jeita mm 0.25 0.10 1.55 1.40 0.25 0.31 0.20 0.25 0.18 5.0 4.8 4.0 3.8 0.635 1 6.2 5.8 0.89 0.41 0.18 0.05 8 0 o o 0.18 0.2 0.09 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.2 mm maximum per side are not included. sot519-1 99-05-04 03-02-18 (1) w m b p d h e e z e c v m a x a y 1 8 16 9 q a a 1 a 2 l p detail x l (a ) 3 0 2.5 5 mm scale ssop16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm sot519-1 a max. 1.73
cbt3251_1 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 21 december 2005 11 of 16 philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer fig 12. package outline sot403-1 (tssop16) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot403-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 18 16 9 q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 a max. 1.1 pin 1 index
cbt3251_1 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 21 december 2005 12 of 16 philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer 13. soldering 13.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for ?ne pitch smds. in these situations re?ow soldering is recommended. 13.2 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. several methods exist for re?owing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. typical re?ow peak temperatures range from 215 cto270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: ? below 225 c (snpb process) or below 245 c (pb-free process) C for all bga, htsson..t and ssop..t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. ? below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. 13.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ? for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
cbt3251_1 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 21 december 2005 13 of 16 philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications. 13.4 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 c and 320 c. 13.5 package related soldering information [1] for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales of?ce. [2] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . [3] these transparent plastic packages are extremely sensitive to re?ow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared re?ow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the re?ow oven. the package body peak temperature must be kept as low as possible. table 9: suitability of surface mount ic packages for wave and re?ow soldering methods package [1] soldering method wave re?ow [2] bga, htsson..t [3] , lbga, lfbga, sqfp, ssop..t [3] , tfbga, vfbga, xson not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable [4] suitable plcc [5] , so, soj suitable suitable lqfp, qfp, tqfp not recommended [5] [6] suitable ssop, tssop, vso, vssop not recommended [7] suitable cwqccn..l [8] , pmfp [9] , wqccn..l [8] not suitable not suitable
cbt3251_1 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 21 december 2005 14 of 16 philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer [4] these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [6] wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on ?ex foil. however, the image sensor package can be mounted by the client on a ?ex foil by using a hot bar soldering process. the appropriate soldering pro?le can be provided on request. [9] hot bar soldering or manual soldering is suitable for pmfp packages. 14. abbreviations 15. revision history table 10: abbreviations acronym description cdm charged device model esd electrostatic discharge fet field-effect transistor hbm human body model mm machine model prr pulse repetition rate ttl transistor-transistor logic table 11: revision history document id release date data sheet status change notice doc. number supersedes cbt3251_1 20051221 product data sheet - - -
philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer cbt3251_1 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 21 december 2005 15 of 16 16. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 17. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 18. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. 19. trademarks notice all referenced brands, product names, service names and trademarks are the property of their respective owners. 20. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com level data sheet status [1] product status [2] [3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn).
? koninklijke philips electronics n.v. 2005 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 21 december 2005 document number: cbt3251_1 published in the netherlands philips semiconductors cbt3251 1-of-8 fet multiplexer/demultiplexer 21. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 functional description . . . . . . . . . . . . . . . . . . . 4 6.1 function selection. . . . . . . . . . . . . . . . . . . . . . . 4 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 recommended operating conditions. . . . . . . . 4 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 5 10.1 ac waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13.1 introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13.2 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 12 13.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 13.4 manual soldering . . . . . . . . . . . . . . . . . . . . . . 13 13.5 package related soldering information . . . . . . 13 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 16 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15 17 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 18 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 19 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 20 contact information . . . . . . . . . . . . . . . . . . . . 15

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